Specialist/LEAD, Mechanical Engineer (Electronic Packaging)

Job Details

  • ID#49398458
  • Address 14603 , Rochester,

    New York

    Rochester USA
  • Job type


  • Salary USD $69,500 - $128,500 69500 - 128500
  • Hiring Company

    Bestinfo Systems LLC

  • Showed04th March 2023
  • Date03rd March 20232023-03-03T00:00:00-0800
  • Deadline02nd May 2023
  • Category

    Et cetera

Specialist/LEAD, Mechanical Engineer (Electronic Packaging)

Vacancy expired!

Specialist/LEAD, Mechanical Engineer (Electronic Packaging)Rochester, NYFull-Time(FTE) Hi,Greetings from Bestinfo Systems LLCWe have a job opportunity that matches your profile.Kindly check the below position and revert me back with your updated resume.

Job Title: Specialist/LEAD, Mechanical Engineer (Electronic Packaging)

Location: Rochester, NY(On-site)

Job Type: Full-Time(FTE)

Industry: Aerospace / Aviation / Defense

Job Category: Engineering - Mechanical

Essential Functions:Design and Development of rugged, high performance, complex electro-mechanical hardware and packaging for harsh environments.Executing design engineering trade studies in a structured, detailed manner, within a cross functional environment to identify and recommend solutions meeting technical, cost, quality and schedule requirements.Development of innovative packaging solutions that solve challenging size, weight, and power requirements.

Qualifications:Ability to obtain security clearance.BS in Mechanical Engineering from an accredited college/university(4) years minimum experience working as a mechanical engineer.Experience in the area of assembly design and packaging of physical components.Experience in CAD 3D Design/Modeling techniques.Excellent Communication skills and interpersonal skills.Ability to work independently or within a multi-disciplined team environment.Experienced presenting Design Reviews to team leaders.Experienced in the application of ASME Y14.5 GD&T.Knowledge of design practices with respect to tolerances, variation of material properties, and DFMA.Experienced in working as part of a mechanical design team and leading small teams of MCAD Designers and mechanical engineers.

Preferred Additional Skills:Experience electro-mechanical packaging and engineering of Rugged Electronics Packages.DFMA Analysis.Tolerance Stack-up Analysis.Design, Schedule and Cost Estimating for Proposals experienceProficient in PTC CREO.Direct experience with mounting circuit card assemblies (CCA) into rugged lightweight enclosures.Knowledge of ESD/EMI use of gaskets, coatings, connectors desired.Photosensitive detectors, thin film coatings, & adhesives experience.

SKILLS AND CERTIFICATIONS:Electronic Packaging ExperienceAble to work at Rochester location

Vacancy expired!