Job Details

  • ID#37681302
  • Address 92602 , Irvine,

    California

    Irvine USA
  • Job type

    Permanent

  • Salary USD $160,000 - $200,000 per year 160000 - 200000 per year
  • Hiring Company

    Jobot

  • Showed04th April 2022
  • Date03rd April 20222022-04-03T03:00:00-0400
  • Deadline02nd June 2022
  • Category

    Architect/engineer/CAD

Lead IC Packaging Engineer

Vacancy expired!

Lead Packaging Engineer Needed / Remote / 200KThis Jobot Job is hosted by: Kevin SzilagyiAre you a fit? Easy Apply now by clicking the "Apply Now" button and sending us your resume.Salary: $160,000 - $200,000 per year

A bit about us:If you are a Lead IC Packaging Engineer willing to work with an exciting innovative start up this opportunity is for you! Established in November 2017 known as a pioneer in the innovation and development of automotive-grade MEMS LiDAR. The company is committed to providing high-performance, miniaturized, integrated MEMS LiDAR products in mass production. It would develop reliable, wide-view, long-distance, and high-resolution 3D depth vision for applications such as robotics and autonomous vehicles. We have a world-class technology R&D team with many years of R&D experience and rich industrial resources in integrated optoelectronic chips, IC chips and solid-state lidar systems, signal processing algorithms, etc.

Why join us?
  • Competitive base salary
  • Great start up working environment
  • Overall great place to grow professionally

Job DetailsResponsibility
  • Responsible to lead advanced development of high-performance LiDAR front-end chipsets, including chip-on-chip and 2.5D/3D packaging.
  • Work with bumping, packaging, and substrate suppliers to define the development, certification, and mass production plans
  • Complete the feasibility analysis, cost analysis, and design rules of the packaging solution
  • Use professional knowledge of packaging process and cost model to support supplier selection, process review, and technical evaluation
  • Interface with chip design, testing, and application engineers, understanding and negotiating design specs, acceptance test standards, etc.
  • Maintain design rules, create, and maintain process specification documents, application instructions of packaging solutions.
Qualifications and Requirements
  • Electrical Engineering or equivalent5+ years' experience of design and execution of semiconductor packaging
  • An expert in the semiconductor packaging process, including bumping, die-attach, flip-chip, underfill, wire-bonding, etc.
  • Deep understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
  • Good problem-solving skills with strong physics fundamentals and knowledge in materials characterization and analysis
  • Have working knowledge of FCBGA, Wafer Level Packaging, 2.5D/3D packaging technology.
  • Familiar with IC packaging design tools, APD, virtuoso, etc.
  • Good communication skills that can enable the candidate to work well with internal cross-functional teams and overseas suppliers.
  • Ability to work independently and tackle projects with minimum supervision.
Interested in hearing more? Easy Apply now by clicking the "Apply Now" button.

Vacancy expired!

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