Packaging Module Development Engineer

Job Details

• ID#55250067
• Address 85001 , Phoenix, Arizona Phoenix USA
• Job type Full-time
• Salary USD $85.2k - $162.5k 85.2k - 162.5k
• Hiring Company Intel Corporation
• Showed01st August 2026
• Date31st July 20262026-07-31T00:00:00-0700
• Deadline29th September 2026
• CategoryInternet engineering